Books by Michael (University of Maryland Pecht

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Presents a treatment that begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development. It is both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques.