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Books by Shichun Qu

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  • Wafer-Level Chip-Scale Packaging af Shichun Qu
    Wafer-Level Chip-Scale Packaging
    - Analog and Power Semiconductor Applications
    by Shichun Qu & Yong Liu
    £124.49

    Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

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