Books by Yong Liu

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes.

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.