Books in the Thermal Management of Microelectronic and Electronic System Series series

Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations This book is designed to help students, operations engineers, and mechanical and electrical engineers in the electronic packaging industry grasp the principles of operation for a wide range of heat pipes.

This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.

Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate.