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  5. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

By Lih-Tyng Hwang

part of the Wiley - IEEE series

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang Save 12% from RPP Save 12%
About 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail * Provides chapter-wise review questions and powerpoint slides as teaching tools

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  • Language:
  • English
  • ISBN:
  • 9781119289647
  • Binding:
  • Hardback
  • Pages:
  • 464
  • Published:
  • June 18, 2018
  • Dimensions:
  • 168x239x28 mm.
  • Weight:
  • 839 g.
Delivery: 2-4 weeks
Expected delivery: January 29, 2025

About Lih-Tyng Hwang

View all books by Lih-Tyng Hwang

Description of 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
* Provides chapter-wise review questions and powerpoint slides as teaching tools

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