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3D Integration in VLSI Circuits

- Implementation Technologies and Applications

part of the Devices, Circuits, and Systems series

3D Integration in VLSI Circuits
About 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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  • Language:
  • English
  • ISBN:
  • 9781032095547
  • Binding:
  • Paperback
  • Pages:
  • 234
  • Published:
  • June 29, 2021
  • Dimensions:
  • 156x234x0 mm.
  • Weight:
  • 426 g.
Delivery: 1-2 weeks
Expected delivery: December 13, 2024
Extended return policy to January 30, 2025

Description of 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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