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3D Microelectronic Packaging
- From Architectures to Applications
- Binding:
- Hardback
- Pages:
- 622
- Published:
- November 23, 2020
- Edition:
- 22021
- Dimensions:
- 155x235x0 mm.
- Weight:
- 1118 g.
Delivery:
2-3 weeks
Expected delivery: December 15, 2024
Description of 3D Microelectronic Packaging
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
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