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Adhesion in Microelectronics
- Binding:
- Hardback
- Pages:
- 368
- Published:
- October 23, 2014
- Dimensions:
- 163x244x25 mm.
- Weight:
- 636 g.
Delivery:
2-4 weeks
Expected delivery: January 25, 2025
Extended return policy to January 30, 2025
Description of Adhesion in Microelectronics
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.
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