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Adhesion in Microelectronics
- Binding:
- Hardback
- Pages:
- 368
- Published:
- October 24, 2014
- Dimensions:
- 163x244x25 mm.
- Weight:
- 636 g.
Delivery:
2-4 weeks
Expected delivery: May 31, 2024
Description of Adhesion in Microelectronics
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.
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