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Advanced Materials for Interconnections
- Binding:
- Hardback
- Pages:
- 460
- Published:
- December 17, 1997
- Dimensions:
- 152x229x0 mm.
- Weight:
- 1130 g.
Delivery:
2-3 weeks
Expected delivery: January 19, 2025
About Th. (Zentrum fur Mikrotechnologien Gessner
View all books by Th. (Zentrum fur Mikrotechnologien GessnerDescription of Advanced Materials for Interconnections
Contains chapter related to Metallization that discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. This book also covers Process Integration.
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