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Advanced Materials for Thermal Management of Electronic Packaging
- Binding:
- Hardback
- Pages:
- 618
- Published:
- January 10, 2011
- Dimensions:
- 159x242x53 mm.
- Weight:
- 1102 g.
Delivery:
2-3 weeks
Expected delivery: October 20, 2024
Description of Advanced Materials for Thermal Management of Electronic Packaging
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.
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