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Advanced Thermal Stress Analysis of Smart Materials and Structures
part of the Structural Integrity series
- Binding:
- Paperback
- Pages:
- 304
- Published:
- September 18, 2020
- Edition:
- 12020
- Dimensions:
- 155x235x0 mm.
- Weight:
- 486 g.
Delivery:
1-2 weeks
Expected delivery: December 5, 2024
Description of Advanced Thermal Stress Analysis of Smart Materials and Structures
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
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