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Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
- Binding:
- Paperback
- Pages:
- 138
- Published:
- November 24, 2024
- Dimensions:
- 156x234x0 mm.
- Weight:
- 281 g.
Delivery:
1-2 weeks
Expected delivery: December 15, 2024
Extended return policy to January 30, 2025
Description of Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand defect prevention, and explore optimizing processes by reducing defects using AI and IoT technologies. It charts a course where semiconductor manufacturing defects are minimized and maximizes productivity.
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