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Advances In 3d Integrated Circuits And Systems

By Hao Yu, Chuan Seng Tan

part of the Series on Emerging Technologies in Circuits and Systems series

Advances In 3d Integrated Circuits And Systems by Hao Yu Save 11% from RPP Save 11%
About Advances In 3d Integrated Circuits And Systems

3D integration is an emerging technology for the design of many-core microprocessors and memory integration.

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  • Language:
  • English
  • ISBN:
  • 9789814699013
  • Binding:
  • Paperback
  • Pages:
  • 392
  • Published:
  • October 15, 2015
  • Dimensions:
  • 230x155x22 mm.
  • Weight:
  • 562 g.
Delivery: 2-4 weeks
Expected delivery: November 24, 2024

About Hao Yu

View all books by Hao Yu

Description of Advances In 3d Integrated Circuits And Systems

3D integration is an emerging technology for the design of many-core microprocessors and memory integration.

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