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Advances In 3d Integrated Circuits And Systems
- Binding:
- Paperback
- Pages:
- 392
- Published:
- October 15, 2015
- Dimensions:
- 230x155x22 mm.
- Weight:
- 562 g.
Delivery:
2-4 weeks
Expected delivery: January 25, 2025
Extended return policy to January 30, 2025
Description of Advances In 3d Integrated Circuits And Systems
3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
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