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Asia Bond Monitor – November 2018
part of the Asia Bond Monitor series
- Binding:
- Paperback
- Pages:
- 146
- Published:
- November 29, 2018
- Dimensions:
- 280x217x18 mm.
- Weight:
- 508 g.
Delivery:
1-2 weeks
Expected delivery: July 23, 2025
Description of Asia Bond Monitor – November 2018
Reviews developments in East Asian local currency bond markets during the third quarter of 2018 and provides outlook, risks, and policy options. Highlights include a focus on the impact of the Asian Bond Markets Initiative on the region's bond market development and a presentation of results from the AsianBondsOnline bond market liquidity survey.
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