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  4. ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

By American Society of Mechanical Engineers
ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)By American Society of Mechanical Engineers
About ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

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  • Language:
  • English
  • ISBN:
  • 9780791884041
  • Binding:
  • Paperback
  • Pages:
  • 566
  • Published:
  • July 31, 2024
  • Dimensions:
  • 213x276x0 mm.
  • Weight:
  • 800 g.
Delivery: 2-4 weeks
Expected delivery: October 21, 2024

About American Society of Mechanical Engineers

View all books by American Society of Mechanical Engineers

Description of ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

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