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This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. A special chapter is given on deformation in silicides in the nano scale.
This book focuses on Creep in Ceramics. In part A general knowledge of creep in ceramics is considered, while part B specifies creep in technologically important ceramics, namely creep in oxide ceramics, carnides and nitrides.
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