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Books by K. L. Mittal

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  • - Applications in Adhesion and Related Areas
    by K. L. Mittal & Wei-Sheng Lei
    £163.99

    The acronym Laser is derived from Light Amplification by Stimulated Emission of Radiation. With the advent of the ruby laser in 1960, there has been tremendous research activity in developing novel, more versatile and more efficient laser sources or devices, as lasers applications are ubiquitous. Today, lasers are used in many areas of human endeavor and are routinely employed in a host of diverse fields: various branches of engineering, microelectronics, biomedical, medicine, dentistry, surgery, surface modification, to name just a few. In this book (containing 10 chapters) we have focused on application of lasers in adhesion and related areas. The topics covered include: Topographical modification of polymers and metals by laser ablation to create superhydrophobic surfaces. Non-ablative laser surface modification. Laser surface modification to enhance adhesion. Laser surface engineering of materials to modulate their wetting behavior. Laser surface modification in dentistry. Laser polymer welding. Laser based adhesion testing technique to measure thin film-substrate interface toughness. Laser surface removal of hard thin ceramic coatings. Laser removal of particles from surfaces. Laser induced thin film debonding for micro-device fabrication applications.

  • by K. L. Mittal
    £153.49

    The book provides a unique overview on laser techniques and applications for the purpose of improving adhesion by altering surface chemistry and topography/morphology of the substrate.

  • by K. L. Mittal
    £153.49

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.

  • by K. L. Mittal
    £153.49

    The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments.

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