Books by Xingcun Colin Tong

To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices.

This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

Exploring the role of EMI shielding in EMC design, this book introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding. It covers an array of issues in advanced shielding materials and design solutions, including enclosures and composites.