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Chemical-Mechanical Planarization of Semiconductor Materials
part of the Springer Series in Materials Science series
- Language:
- English
- ISBN:
- 9783540431817
- Binding:
- Hardback
- Pages:
- 428
- Published:
- January 25, 2004
- Edition:
- 2004
- Dimensions:
- 155x235x26 mm.
- Weight:
- 1760 g.
Delivery:
2-3 weeks
Expected delivery: January 11, 2025
Extended return policy to January 30, 2025
Description of Chemical-Mechanical Planarization of Semiconductor Materials
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
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