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Electrical Modeling and Design for 3D System Integration
- 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
- Binding:
- Hardback
- Pages:
- 384
- Published:
- April 18, 2012
- Dimensions:
- 156x241x18 mm.
- Weight:
- 774 g.
Delivery:
2-4 weeks
Expected delivery: May 22, 2025
Description of Electrical Modeling and Design for 3D System Integration
The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.
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