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Electronic System-Level HW/SW Co-Design of Heterogeneous Multi-Processor Embedded Systems
- Binding:
- Hardback
- Pages:
- 270
- Published:
- August 15, 2016
- Dimensions:
- 156x234x16 mm.
- Weight:
- 571 g.
Delivery:
2-3 weeks
Expected delivery: July 25, 2024
Description of Electronic System-Level HW/SW Co-Design of Heterogeneous Multi-Processor Embedded Systems
Provides models, methodologies and tools to support each step of the co-design flow of embedded systems implemented by exploiting heterogeneous multi-processor architectures mapped on distributed systems, as well as fully integrated onto a single chip.
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