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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research
- Binding:
- Hardback
- Pages:
- 432
- Published:
- December 17, 2014
- Dimensions:
- 170x24x244 mm.
- Weight:
- 885 g.
Delivery:
2-3 weeks
Expected delivery: December 12, 2024
Description of Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research
The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a compr...
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