Fan-Out Wafer-Level Packaging | John H. Lau | Buy Fan-Out Wafer-Level Packaging as book, hardback from TalesFan-Out Wafer-Level Packaging - tales.as

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Fan-Out Wafer-Level Packaging by John H. Lau

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Hardback
2-3 weeks
£114.49

About Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

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Language:
English

ISBN:
9789811088834

Publisher:
Springer Verlag, Singapore

Binding:
Hardback

Pages:
303

Published:
April 12, 2018

Edition:
12018

Dimensions:
241x170x27 mm.

Weight:
660 g.

£114.49 + Shipping
~~£114.49~~

Delivery: 2-3 weeks

Expected delivery: December 12, 2024

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About John H. Lau

View all books by John H. Lau

Description of Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

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