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Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
- Binding:
- Paperback
- Pages:
- 40
- Published:
- February 16, 2014
- Edition:
- 2014
- Dimensions:
- 155x235x0 mm.
- Weight:
- 949 g.
Delivery:
1-2 weeks
Expected delivery: February 26, 2025
Description of Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data.
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