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Heterogeneous Integrations
- Binding:
- Hardback
- Pages:
- 368
- Published:
- April 11, 2019
- Edition:
- 12019
- Dimensions:
- 155x235x0 mm.
- Weight:
- 752 g.
Delivery:
2-4 weeks
Expected delivery: December 18, 2024
Description of Heterogeneous Integrations
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
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