Join thousands of book lovers
Sign up to our newsletter and receive discounts and inspiration for your next reading experience.
By signing up, you agree to our Privacy Policy.You can, at any time, unsubscribe from our newsletters.
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
Save
1%
from RPP
Save
1%
- Binding:
- Paperback
- Pages:
- 170
- Published:
- May 18, 2014
- Dimensions:
- 148x11x210 mm.
- Weight:
- 255 g.
Delivery:
1-2 weeks
Expected delivery: June 29, 2025
User ratings of High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
Rate this book
In order to rate this book you must be logged in.Others also bought..
Find similar books
The book High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method can be found in the following categories: