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High-Temperature Superconductor Materials, Devices, and Applications
- Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004
part of the Ceramic Transactions Series series
- Binding:
- Paperback
- Pages:
- 98
- Published:
- March 15, 2006
- Dimensions:
- 153x234x6 mm.
- Weight:
- 145 g.
Delivery:
2-4 weeks
Expected delivery: December 20, 2024
Description of High-Temperature Superconductor Materials, Devices, and Applications
These proceedings investigate the relationship between features at the atomic level including oxygen vacancies, stacking faults and site order/disorder, grain boundaries, film-substrate interactions, buffer-superconductor interactions, thermodynamic, transport, and other macroscopic properties.
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