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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
- Binding:
- Hardback
- Pages:
- 645
- Published:
- May 18, 2025
- Dimensions:
- 155x235x0 mm.
Delivery:
2-4 weeks
Expected delivery: August 17, 2025
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