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Hybrid Systems-in-Foil
- Binding:
- Paperback
- Pages:
- 75
- Published:
- October 13, 2021
- Edition:
- Dimensions:
- 228x154x9 mm.
- Weight:
- 152 g.
Delivery:
1-2 weeks
Expected delivery: January 2, 2025
Extended return policy to January 30, 2025
Description of Hybrid Systems-in-Foil
An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
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