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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
- A Focus on Reliability
- Binding:
- Hardback
- Pages:
- 464
- Published:
- March 15, 1994
- Dimensions:
- 163x238x31 mm.
- Weight:
- 840 g.
Delivery:
2-4 weeks
Expected delivery: December 19, 2024
Description of Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.
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