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International Conference on Intelligent Computing and Smart Communication 2019

About International Conference on Intelligent Computing and Smart Communication 2019

This book gathers high-quality research papers presented at the First International Conference, ICSC 2019, organised by THDC Institute of Hydropower Engineering and Technology, Tehri, India, from 20 to 21 April 2019. The book is divided into two major sections ¿ Intelligent Computing and Smart Communication. Some of the areas covered are Parallel and Distributed Systems, Web Services, Databases and Data Mining Applications, Feature Selection and Feature Extraction, High-Performance Data Mining Algorithms, Knowledge Discovery, Communication Protocols and Architectures, High-speed Communication, High-Voltage Insulation Technologies, Fault Detection and Protection, Power System Analysis, Embedded Systems, Architectures, Electronics in Renewable Energy, CAD for VLSI, Green Electronics, Signal and Image Processing, Pattern Recognition and Analysis, Multi-Resolution Analysis and Wavelets, 3D and Stereo Imaging, and Neural Networks.

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  • Language:
  • English
  • ISBN:
  • 9789811506321
  • Binding:
  • Hardback
  • Pages:
  • 1689
  • Published:
  • January 8, 2020
  • Edition:
  • 12020
  • Dimensions:
  • 155x235x0 mm.
  • Weight:
  • 2926 g.
Delivery: 2-4 weeks
Expected delivery: August 6, 2025

Description of International Conference on Intelligent Computing and Smart Communication 2019

This book gathers high-quality research papers presented at the First International Conference, ICSC 2019, organised by THDC Institute of Hydropower Engineering and Technology, Tehri, India, from 20 to 21 April 2019. The book is divided into two major sections ¿ Intelligent Computing and Smart Communication. Some of the areas covered are Parallel and Distributed Systems, Web Services, Databases and Data Mining Applications, Feature Selection and Feature Extraction, High-Performance Data Mining Algorithms, Knowledge Discovery, Communication Protocols and Architectures, High-speed Communication, High-Voltage Insulation Technologies, Fault Detection and Protection, Power System Analysis, Embedded Systems, Architectures, Electronics in Renewable Energy, CAD for VLSI, Green Electronics, Signal and Image Processing, Pattern Recognition and Analysis, Multi-Resolution Analysis and Wavelets, 3D and Stereo Imaging, and Neural Networks.

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