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MEMS Packaging Technologies and 3D Integration
- Binding:
- Hardback
- Pages:
- 210
- Published:
- May 31, 2022
- Dimensions:
- 175x18x250 mm.
- Weight:
- 727 g.
Delivery:
2-3 weeks
Expected delivery: August 25, 2025
Description of MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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