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Microelectronic Packaging
part of the New Trends in Electrochemical Technology series
- Binding:
- Hardback
- Pages:
- 564
- Published:
- December 19, 2004
- Dimensions:
- 156x234x30 mm.
- Weight:
- 907 g.
Delivery:
2-3 weeks
Expected delivery: January 19, 2025
Description of Microelectronic Packaging
With the advent of electrochemical processing technologies for chips metallization, there has been corresponding development of equipment compatible with semiconductor industry standards. These include high volume manufacturing tools that are
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