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Microelectronics, Electromagnetics and Telecommunications
- Proceedings of ICMEET 2017
part of the Lecture Notes in Electrical Engineering series
- Binding:
- Paperback
- Pages:
- 915
- Published:
- February 10, 2019
- Edition:
- 12018
- Dimensions:
- 155x235x0 mm.
- Weight:
- 1413 g.
Delivery:
1-2 weeks
Expected delivery: December 6, 2024
Description of Microelectronics, Electromagnetics and Telecommunications
The volume contains 94 best selected research papers presented at the Third International Conference on Micro Electronics, Electromagnetics and Telecommunications (ICMEET 2017) The conference was held during 09-10, September, 2017 at Department of Electronics and Communication Engineering, BVRIT Hyderabad College of Engineering for Women, Hyderabad, Telangana, India. The volume includes original and application based research papers on microelectronics, electromagnetics, telecommunications, wireless communications, signal/speech/video processing and embedded systems.
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