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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
- Binding:
- Paperback
- Pages:
- 434
- Published:
- November 14, 2019
- Dimensions:
- 229x153x30 mm.
- Weight:
- 698 g.
Delivery:
1-2 weeks
Expected delivery: November 17, 2024
About Hengyun (Shanghai University of Engineering Science Zhang
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