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Noise Coupling in System-on-Chip

About Noise Coupling in System-on-Chip

The book presents information written by international experts in the field of Systems on Chip (SoC) Coupling, including substrate and interconnect magnetic crosstalk, 2D and 3D circuits noise coupling, and TSV and simulation. It enables the reader to analyze crosstalk noise propagating through the parasitics interconnect and package and the PCB.

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  • Language:
  • English
  • ISBN:
  • 9781498796774
  • Binding:
  • Hardback
  • Pages:
  • 518
  • Published:
  • December 26, 2017
  • Dimensions:
  • 243x164x30 mm.
  • Weight:
  • 1016 g.
Delivery: 2-3 weeks
Expected delivery: November 22, 2024

Description of Noise Coupling in System-on-Chip

The book presents information written by international experts in the field of Systems on Chip (SoC) Coupling, including substrate and interconnect magnetic crosstalk, 2D and 3D circuits noise coupling, and TSV and simulation. It enables the reader to analyze crosstalk noise propagating through the parasitics interconnect and package and the PCB.

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