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Poly-SiGe for MEMS-above-CMOS Sensors
- Binding:
- Hardback
- Pages:
- 199
- Published:
- July 29, 2013
- Edition:
- 2014
- Dimensions:
- 155x235x14 mm.
- Weight:
- 4498 g.
Delivery:
2-3 weeks
Expected delivery: November 22, 2024
Description of Poly-SiGe for MEMS-above-CMOS Sensors
Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS.
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