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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
- Binding:
- Hardback
- Pages:
- 226
- Published:
- March 28, 2019
- Dimensions:
- 241x164x16 mm.
- Weight:
- 506 g.
Delivery:
2-4 weeks
Expected delivery: October 13, 2024
Description of Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
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