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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

By ASME
About Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.

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  • Language:
  • English
  • ISBN:
  • 9780791859322
  • Binding:
  • Paperback
  • Pages:
  • 836
  • Published:
  • June 30, 2020
  • Dimensions:
  • 279x215x48 mm.
  • Weight:
  • 1884 g.
  In stock
Delivery: 3-5 business days
Expected delivery: October 10, 2024

Description of Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.

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