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Rapid Thermal Processing for Future Semiconductor Devices
- Binding:
- Paperback
- Pages:
- 160
- Published:
- April 1, 2003
- Dimensions:
- 234x156x9 mm.
- Weight:
- 310 g.
Delivery:
1-2 weeks
Expected delivery: August 10, 2025
About H. (Muroran Institute of Technology Fukuda
View all books by H. (Muroran Institute of Technology FukudaDescription of Rapid Thermal Processing for Future Semiconductor Devices
A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe and hetero-structure.
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