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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
- Binding:
- Hardback
- Pages:
- 482
- Published:
- May 22, 2015
- Dimensions:
- 152x229x0 mm.
- Weight:
- 830 g.
Delivery:
2-3 weeks
Expected delivery: June 10, 2024
Description of Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.
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