Join thousands of book lovers
Sign up to our newsletter and receive discounts and inspiration for your next reading experience.
By signing up, you agree to our Privacy Policy.You can, at any time, unsubscribe from our newsletters.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
- Binding:
- Hardback
- Pages:
- 482
- Published:
- May 21, 2015
- Dimensions:
- 152x229x0 mm.
- Weight:
- 830 g.
Delivery:
2-3 weeks
Expected delivery: December 12, 2024
Description of Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.
User ratings of Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Rate this book
In order to rate this book you must be logged in.Others also bought..
Find similar books
The book Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture can be found in the following categories:
You can, at any time, unsubscribe from our newsletters.
© 2024 Tales
All packages are shipped from our warehouse in the UK.
Company address: Esromgade 15, 3. - 2200 - DK
Registered company number: DK43351621
