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Semiconductor Packaging

- Materials Interaction and Reliability

About Semiconductor Packaging

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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  • Language:
  • English
  • ISBN:
  • 9781439862056
  • Binding:
  • Hardback
  • Pages:
  • 216
  • Published:
  • October 9, 2011
  • Dimensions:
  • 156x241x17 mm.
  • Weight:
  • 472 g.
Delivery: 2-3 weeks
Expected delivery: October 12, 2025

Description of Semiconductor Packaging

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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