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About SemiConductor Wafer Bonding

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

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  • Language:
  • English
  • ISBN:
  • 9780471574811
  • Binding:
  • Hardback
  • Pages:
  • 320
  • Published:
  • December 17, 1998
  • Dimensions:
  • 164x246x20 mm.
  • Weight:
  • 517 g.
Delivery: 2-4 weeks
Expected delivery: December 19, 2024

Description of SemiConductor Wafer Bonding

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

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