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Sic Power Module Design: Performance, Robustness and Reliability
part of the Energy Engineering series
- Binding:
- Hardback
- Pages:
- 360
- Published:
- February 3, 2022
- Dimensions:
- 160x25x239 mm.
- Weight:
- 662 g.
Delivery:
2-3 weeks
Expected delivery: July 25, 2024
Description of Sic Power Module Design: Performance, Robustness and Reliability
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
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