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Stress Analysis of Bonded Assemblies

- Applications in Microelectronics

  • Language:
  • English
  • ISBN:
  • 9783639060324
  • Binding:
  • Paperback
  • Pages:
  • 256
  • Published:
  • September 2, 2008
  • Dimensions:
  • 152x229x14 mm.
  • Weight:
  • 345 g.
Delivery: 1-2 weeks
Expected delivery: December 11, 2024

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