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System-in-Package
- Electrical and Layout Perspectives
- Binding:
- Paperback
- Pages:
- 94
- Published:
- June 29, 2011
- Dimensions:
- 156x234x5 mm.
- Weight:
- 146 g.
Delivery:
1-2 weeks
Expected delivery: November 29, 2024
Description of System-in-Package
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
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