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Systems, Software and Services Process Improvement

- 30th European Conference, Eurospi 2023, Grenoble, France, August 30 - September 1, 2023, Proceedings, Part II

About Systems, Software and Services Process Improvement

This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.

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  • Language:
  • English
  • ISBN:
  • 9783031423093
  • Binding:
  • Paperback
  • Pages:
  • 315
  • Published:
  • August 29, 2023
  • Dimensions:
  • 156x234x18 mm.
  • Weight:
  • 481 g.
Delivery: 2-4 weeks
Expected delivery: December 22, 2024
Extended return policy to January 30, 2025

Description of Systems, Software and Services Process Improvement

This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.

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