Join thousands of book lovers
Sign up to our newsletter and receive discounts and inspiration for your next reading experience.
By signing up, you agree to our Privacy Policy.You can, at any time, unsubscribe from our newsletters.
TEI 17 Eleventh International Conference on Tangible, Embedded, and Embodied Interaction
- Binding:
- Paperback
- Pages:
- 806
- Published:
- September 14, 2017
- Dimensions:
- 216x279x41 mm.
- Weight:
- 1833 g.
Delivery:
1-2 weeks
Expected delivery: November 29, 2024
User ratings of TEI 17 Eleventh International Conference on Tangible, Embedded, and Embodied Interaction
Rate this book
In order to rate this book you must be logged in.Others also bought..
Find similar books
The book TEI 17 Eleventh International Conference on Tangible, Embedded, and Embodied Interaction can be found in the following categories: