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Temperature-Aware Design and Management for 3D Multi-Core Architectures
- Binding:
- Paperback
- Pages:
- 96
- Published:
- January 26, 2014
- Dimensions:
- 156x234x5 mm.
- Weight:
- 148 g.
Delivery:
1-2 weeks
Expected delivery: November 29, 2024
Description of Temperature-Aware Design and Management for 3D Multi-Core Architectures
Surveys recent advances in temperature-aware 3D Multiprocessor Systems-on-Chip (3D MPSoCs) considerations. The book explores the recent advanced cooling strategies, thermal modelling frameworks, design-time optimizations, and run-time thermal management schemes that are primarily targeted for 3D MPSoCs.
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