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Thermal Design of Electronic Equipment
part of the Electronics Handbook Series series
- Binding:
- Hardback
- Pages:
- 396
- Published:
- September 26, 2000
- Dimensions:
- 241x168x28 mm.
- Weight:
- 732 g.
Delivery:
2-3 weeks
Expected delivery: January 10, 2025
Extended return policy to January 30, 2025
Description of Thermal Design of Electronic Equipment
Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.
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